Industry
Type
Our Products
MA-001
Single Component Non Frozen Non-Conductive Die Attach Adhesive for up to 280°C
MA-003
A Very High Thermally Conductive Die Attach Adhesive at >11w/Mk -100% Solids and Used Consistently at over 60GHz
MA-006
Sintered Silver Electrically Conductive Die Attach Adhesive
MA-007
Flexible High Temperature Electrically Conductive Adhesive
Model Name:
Industry:
Type:
MA-008
A High Performance Single Component Non Frozen Conductive Epoxy for Die Attach Approved to 20+GHz and an Operating Temperature Range of -55°C to +200°C
MA-009
A Single Component Thermally Conductive Toughened Microelectronic Grade Nonconductive Die Attach Adhesive with a Service Temperature of <-65°C to Over >340°C and Meets NASA Low Outgassing Specifications
MA-012
A Single Component Toughened Microelectronic Grade Package Sealant with a Service Temperature of <-55°C to Over >300°C and Meets NASA Low Outgassing Specifications
MA-013
Non-Conductive Die Attach Adhesive a High Performance Single Component Non Frozen Non-Conductive Epoxy for SMD and Die Attach with an Operating Temperature Range of -65°C to +240°C
MA-014
A Single Component Toughened Microelectronic Grade Non-Conductive Die Attach Adhesive with a Service Temperature of <-65°C to Over >340°C a Thermal Conductivity of 4w/Mk and Meets NASA Low Outgassing Specifications
MA-016
Extremely Low MSL High Adhesion Conductive Die Attach Adhesive
MA-017
An Electrically and Thermally Conductive Silver Filled Inorganic One-Part Adhesive for Use to >650°C
MA-018
Extremely Thermally Conductive Flowable BGA Underfill
MA-020
Approved for a Landing On Venus at 450°C an Electrically and Thermally Conductive Silver Filled Inorganic One-Part Adhesive for Use to >650°C
MA-021
Approved for a Landing on Venus at 450°C an Electrically and Thermally Conductive Silver Filled Inorganic One-Part Adhesive for Use to >950°C
MA-022
Two Component Flexible Epoxy System for High Performance Bonding Sealing with a Fast Set Up and Handling Time
MA-023
A Very High Conductivity Single Component Adhesive for MEMS Assembly
MA-024
Two Component Low Viscosity Epoxy System for High Performance Bonding Sealing Coating. Fast Set Up and Handling Time
MA-025
Series A High Performance Single Component Very High Thermal Conductivity Very Low Resistivity Conductive Epoxy Interposer for Connecting Silicon Stacked Die Layers
MA-026
Extremely Low MSL *No Bleed Conductive Die Attach Adhesive
MA-027
A High Performance Single Component Very High Thermal Conductivity Very Low Resistivity Conductive Epoxy Interposer for Connecting Silicon Stacked Die Layers
MA-028
Sub-Micron Electrically Conductive Die Attach Adhesive
MA-029
GPD Global Vertical Interconnects with Microshot Dispensing and Microcoat Technologies
MA-031
A Single Component Toughened Microelectronic Grade Glob Top with a Service Temperature of <-65°C to Over >340°C and Meets NASA Low Outgassing Specifications
MA-033
Microcoat Optically Clear Glob Top Coating for Light Pipes LEDs and Detectors
MA-034
Microcoat Optically Clear Glob Top Coating MCT E-54050 for Light Pipes LEDs Detectors
MA-036
Extremely High Temperature Coating for Auto Headlamps
MA-037
UV Curable Mold Coating for Inductors and Electronic Components (Any Color) Rohs Compliant
MA-038
SupercureTM UV/Visible Light Curable Mold Coating or Surface Coat For LEDs and Inductors
MA-045
Microcoat Light Pipe System No Mixing No De-Airing No Heat Cure No Short Pot Life No Silicones
MA-046
Silicone Light Pipe System for an Opto-Coupler on PCB or Leadframe
MA-051
Spray System, Time Controller, UV Wand System, UV Area Curing System, UV Portable Curing System, UV Basic Curing System, Dispensing Pressure Vessel 0.5L/1L/2L, Semi Automatic Rotary Dispensing System, Pressure Dispensing System 0.5G, Thread Sealer
MA-052
Cartridges, Basic & Automatic Dispensers, Fully Automatic Dispensers and Jetting Nozzles, Dual Cartridge Dispensers, 3CC/5CC/10CC/30CC Barrels
MA-053
Microelectronic Encapsulants High Throughput Solutions with High Reliability Low Stress Coatings